Thin-Film Capacitors for Packaged Electronics by Jain Pushkar, Eugene J. Rymaszewski

By Jain Pushkar, Eugene J. Rymaszewski

Thin-Film Capacitors for Packaged Electronics bargains with the capacitors of a sought after type, nonetheless wanted and in a position to maintaining velocity with the calls for posed by means of ever better degrees of integration. It spans a variety of subject matters, from fabrics homes to limits of what is the easiest you can actually in attaining in capacitor houses to technique modeling to program examples. many of the themes coated are the subsequent:
-Novel insights into basic relationships among dielectric consistent and the breakdown box of fabrics and comparable capacitance density and breakdown voltage of capacitor buildings,
-Electrical characterization suggestions for quite a lot of frequencies (1 kHz to twenty GHz),
-Process modeling to figure out sturdy working issues,
-Prevention of steel (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.

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Therefore, higher packaging densities are possible by integrating thin-film capacitors within the IC multilevel metallization, chip or packaging module or printed wiring board (PWB). 3 Improved Electrical Performance In high performance packaging, surface mount discrete chip capacitors are employed for power decoupling. These capacitors are mounted close to the IC chips they decouple ; for instance , at the corners the IC footprint [13]. These mounting locations attempt to minimize the total inductance of the current supply loop, which consists of the decoupling capacitor, leads connecting the Chapter 1.

Comp o Packag. Technol. 24(3), 526 (2001). 2. However, there are several factors, such as interfacial micro-roughness, deviation from the optimum stoichiometry, and microstructure in the dielectric films, that can degrade the breakdown voltage of a thin-film capacitor from its BOCA values. Some of these factors originate in the capacitor structure and others are the result of a fabrication technique. They are discussed in this chapter; with the experimental emphasis on tantalum oxide films, though the considerations discussed in this chapter hold in general.

The dielectrics like SiO z, ShN4 , and Ta-O, are suitable candidates for embedded capacitor applications operating over wide ranges of frequencies (de to GHz range) and voltages . 6 SUMMARY In this chapter, the fundamental properties of capacitors are summarized along with their relative importance in various capacitor application domains ; namely decoupling, blocking and precision capacitors. High capacitance over a wide range of operating frequencies is needed in decoupling capacitors. Blocking capacitors require minimum leakage currents, and precision capacitors demand tight tolerances in their capacitance and leakage characteristics.

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